The in-vehicle networking market is expected to grow from +1200 million in 2019 to +1900 million by 2024, with a CAGR of + 9% between 2019 and 2024. The market size is expected to reach +1.8 billion units by 2024, a compound annual growth rate of +8.5 percent between 2019 and 2024. This report provides market size and future growth potential for the market across various sectors such as vehicle type, connectivity standards, application, and geography. The study identifies and analyzes market dynamics such as drivers, industry constraints, market opportunities and challenges. It also highlights the key players working in the market. Demand for in-car automobile networks is expected to increase due to increased vehicle production and the trend of escalating vehicle electrification.
The search methodology used to estimate and predict the in-car networking market begins by capturing revenue data from major vendors up to secondary research. Some secondary sources include associations such as the International Building Industries Organization (OCIA), the International Council for Clean Transport, the International Organization of Automobile Manufacturers, and others. Vendor offers were also considered to determine market segmentation. The ascending procedure was used to reach the total volume of the global market from the revenues of the major market players. After reaching the overall market size, the total market was divided into several sectors and sub-categories, which were then verified through preliminary research through extensive interviews with key persons such as CEOs. Triangulation procedures and detailed market data were used to complete the overall engineering process of the market and access accurate statistics for all sectors and sub-sections.
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Key Market Segments:
Key Market players:
NXP Semiconductor NV (Netherlands), Infineon Technologies AG (Germany), Texas Instruments, Inc. (U.S.), Robert Bosch GmbH (Germany), Xilinx, Inc. (U.S.), STMicroelectronics NV (Switzerland), ON Semiconductor Corp. (U.S.), Atmel Corporation (U.S.), Microchip Technology Inc. (U.S.), Elmos Semiconductor AG (Germany), and Melexis Semiconductors (Belgium)
By Vehicle Type:
- Passenger Cars
By Connectivity Standards:
- Body Electronics
- Flex Ray
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Table of Content:
- Analyze market forecasts with recent trends and SWOT analysis
- Market dynamics scenario, along with market growth opportunities in the coming years
- Analyze market segmentation including qualitative and quantitative research involving the impact of economic and non-economic aspects
- Regional and country analysis that integrates supply and demand forces that affect market growth.
- Market value (US $ million) and volume data (million units) for each sector and subsector
- A competitive landscape that includes the market share of key players, as well as new projects and strategies adopted by players in the past five years
- Comprehensive company profiles covering product offerings, key financial information, recent developments, SWOT analysis, and strategies used by key market players
- Analyzer support for one year, along with data support in Excel format.
Chapter 1 Executive Summary
Chapter 2 Abbreviation and Acronyms
Chapter 3 Preface
Chapter 4 Market Landscape
Chapter 5 Market Trend Analysis
Chapter 6 Industry Chain Analysis
Chapter 7 Latest Market Dynamics
Chapter 8 Trading Analysis
Chapter 9 Historical and Current In-Vehicle Networking in North America (2013-2018)
Chapter 10 Historical and Current In-Vehicle Networking in South America (2013-2018)
Chapter 11 Historical and Current In-Vehicle Networking in Asia & Pacific (2013-2018)
Chapter 12 Historical and Current In-Vehicle Networking in Europe (2013-2018)
Chapter 13 Historical and Current In-Vehicle Networking in MEA (2013-2018)
Chapter 14 Summary for Global In-Vehicle Networking (2013-2018)
Chapter 15 Global In-Vehicle Networking Forecast (2019-2023)
Chapter 16 Analysis of Global Key Vendors
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